Preferred Client

Processing Modules
Models below accommodate a single 6" wafer cassett.
Call Terra for other sizes. (Prices include installation)
Cat. # $/Each
Qa Series (details) 7018-28 Login
C Series (details) 7018-29 Login
Nb Series (details) 7018-30 Login
F Series* (details) 7018-31 Login
A Series* (details) 7018-32 Login
Dr Series (details) 9502-00 Login
Rce Series* (details) 7018-34 Login
Processing
Module 		Corresponding
Controls
x=Standard
o=Optional 		Heat Cool Liquid
Level
Sensor
Alarm		 Timer Over/
Under
Temp
Alarm		 Pump/
Filter
Control 		Recirc.
Pump 		Drain
Valve
Control 		Spray
Nozzle
Control 		DI H2O
Injec. 		Cat. # $/Each
Qa Series C1115aLLS x x x o 7018-35 Login
C Series C1115aLLS x   x x       o 7018-39 Login
Nb Series C1815aLSS x x x o x 7018-36 Login
F Series* C21bLSS o o x x x x o x 7018-37 Login
A Series* C21bLSS o o x x x o x v 7018-37 Login
Dr Series C15sa x x x x 7018-38 Login
Rce Series* C21bLSS x x x x x x 7018-37 Login
Options include pneumatic drain valve and magnetic stirrer; call Terra for details.
Power: 110VAC, 5 Amps—F, A, and RCe. 208VAC, 15 Amps—Qa, Nb, RCe (optional)
* Selection of RCe module provides heating/cooling capabilities to the A or F Series modules. Models listed

Process Control Application Chart
Terra’s comprehensive range of constant-temperature baths, etching baths, dump risers, and other processing equipment is ideally suited for the high-purity requirements of the semiconductor industry. Microprocessor controls ensure the integrity of your operations. The chart below indicates the baths best suited for common semiconductor operations. Once you select the equipment that meets your requirements, a Terra process engineer will help configure a turnkey solution.
Product Application Chart
Process, Commercial
or Generic Name		 Process Chemical Composition Concentration Process
Temperature
(Typical) 		Recommended
Product
Aqua Regia Gold Etchant Hydrochloric Acid (HCl)
Nitric Acid (HNO3) 		75%
25% 		90° C Series
Buffered Oxide
Etch (BOE) 		Etch SiO2 Ammonium Fluoride(NH4F)
Aqueous
Hydrofluoric Acid(HF)
Aqueous
 40% 15-40°C
Ambient		 A Series
RCe Series
CP8 Etch Nitric Acid (HNO3)
Hydrofluoric Acid (HF)		   Ambient A Series
Etch (Indium)
Molybdenum Platinum
Nichrome 		Etch Hydrochloric Acid (HCl)
Aqueous
Nitric Acid (HNO3) 		37-38%
70-71%		 QA Series
Metal Etch Etch A1,
AlSi Al Si Cu 		Phosphoric Acid (H3PO4)
Acetic Acid (CH3COOH)
Nitric Acid (HNO3)		 85-87% 30-60°C QA Series
Nitride Etch Etch Phosphoric Acid (H3PO4)
DI Water (H2O) 		85-87%
15-13%
150-185°C NB Series
Organic Stripper Resist Removal PRS-1000
S-43
Lozolin
No Phenol-922		 Full
strength		 Room temperature
120°C		 C Series
Oxide Resist Strip SiO2 Resist Stripping Sulfuric Acid (H2SO4)
Ammonium Persulfate (NH4S2O2)
95-96% QA Series
Phenolic Stripper Resist Removal J100
Bermar 712D
R-10		 95-100°C C Series
Resist Series (Metalized) Resist Removal Chromic Sulfuric Acid
(CrO3+H2SO4) 		  A Series
RCA Clean Pre-Diffusion Cleans
Quartzware 		Step 1: Water
Hydrogen Peroxide (H2O2)
Ammonium Fluoride (NH4CH)
Step 2: DI Water (H2O)
Hydrogen Peroxide (H2O2)
Hydrochloric Acid (HCl)
 40% 75-85°C QA Series
Silicon Etch Etch Acetic Acid (CH3COOH)
Nitric Acid (HNO3)
Hydrofluoric Acid (HF) 		Ambient A Series
Sirtl Etch Etch Chromium Trioxide (CrO3)
DI Water (H20)
Hydrofluoric Acid (HF) 		Ambient A Series
Slope Etch Etch Phosphoric Acid (H3PO4)
Acetic Acid (CH3COOH)
Nitric Acid (HNO3)		 55°C QA Series
Standard Resist Strip
(Do not use w/aluminum) 		SiO2 Resist Strip Sulfuric Acid (H2SO4)
Hydrogen Peroxide (H2O2) 		95-96% 110-140°C QA Series
2:1 Etch Etch DI Water (H2O)
Hydrofluoric Acid (HF) 		Ambient A Series
Wafer Rinsing Rinsing DI Water (H2O) 100% Ambient DR-Series