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Processing Baths

Processing Modules
Models below accommodate a single 6" (152 mm) wafer cassett.
Call Terra for other sizes. (Prices include installation)

Cat. # Price
Qa Series (details) 7018-28 Price
C Series (details) 7018-29 Price
Nb Series (details) 7018-30 Price
F Series* (details) 7018-31 Price
A Series* (details) 7018-32 Price
Dr Series (details) 9502-00 Price
Processing
Module
Corresponding
Controls

x=Standard
o=Optional
Heat Cool Liquid
Level
Sensor
Alarm
Timer Over/
Under
Temp
Alarm
Pump/
Filter
Control
Recirc.
Pump
Drain
Valve
Control
Spray
Nozzle
Control
DI H2O
Injec.
Cat. # Price
Qa Series C1115aLLS x
x x x

o

7018-35 Price
C Series C1115aLLS x   x x x     o

7018-35 Price
Nb Series C1815aLSS x
x x x

o
x 7018-36 Price
F Series*
o o


x x x

7018-37 Price
A Series*
o o




x

7018-37 Price
Rce Series*
Details
C21b x x x x x




7018-37 Price
Dr Series C15sa

x x


x x
7018-38 Price
Options include pneumatic drain valve and magnetic stirrer; call Terra for details.
Power: 110VAC, 5 Amps—F, A, and RCe. 208VAC, 15 Amps—Qa, Nb, RCe (optional)
* Selection of RCe module provides optional heating/cooling capabilities to the A or F Series modules. Model listed is polypropylene; PVDF also available.

Process Control Application Chart

Terra’s comprehensive range of constant-temperature baths, etching baths, dump risers, and other processing equipment is ideally suited for the high-purity requirements of the semiconductor industry. Microprocessor controls ensure the integrity of your operations. The chart below indicates the baths best suited for common semiconductor operations. Once you select the equipment that meets your requirements, a Terra process engineer will help configure a turnkey solution.
Product Application Chart
Process, Commercial
or Generic Name
Process Chemical Composition Concentration Process
Temperature
(Typical)
Recommended
Product
Aqua Regia Gold Etchant Hydrochloric Acid (HCl)
Nitric Acid (HNO3)
75%
25%
90° C Series
Buffered Oxide
Etch (BOE)
Etch SiO2 Ammonium Fluoride(NH4F)
Aqueous
Hydrofluoric Acid(HF)
Aqueous
40% 15-40°C
Ambient
A Series
with RCe
CP8 Etch Nitric Acid (HNO3)
Hydrofluoric Acid (HF)
  Ambient A Series
Etch (Indium)
Molybdenum Platinum
Nichrome
Etch Hydrochloric Acid (HCl)
Aqueous
Nitric Acid (HNO3)
37-38%
70-71%

QA Series
Metal Etch Etch A1,
AlSi Al Si Cu
Phosphoric Acid (H3PO4)
Acetic Acid (CH3COOH)
Nitric Acid (HNO3)
85-87% 30-60°C QA Series
Nitride Etch Etch Phosphoric Acid (H3PO4)
DI Water (H2O)
85-87%
15-13%
150-185°C NB Series
Organic Stripper Resist Removal PRS-1000
S-43
Lozolin
No Phenol-922
Full
strength
Room temperature
120°C
C Series
Oxide Resist Strip SiO2 Resist Stripping Sulfuric Acid (H2SO4)
Ammonium Persulfate (NH4S2O2)
95-96%
QA Series
Phenolic Stripper Resist Removal J100
Bermar 712D
R-10
  95-100°C C Series
Resist Series (Metalized) Resist Removal Chromic Sulfuric Acid
(CrO3+H2SO4)
 
A Series
RCA Clean Pre-Diffusion Cleans
Quartzware
Step 1: Water
Hydrogen Peroxide (H2O2)
Ammonium Fluoride (NH4CH)
Step 2: DI Water (H2O)
Hydrogen Peroxide (H2O2)
Hydrochloric Acid (HCl)
40% 75-85°C QA Series
Silicon Etch Etch Acetic Acid (CH3COOH)
Nitric Acid (HNO3)
Hydrofluoric Acid (HF)
  Ambient A Series
Sirtl Etch Etch Chromium Trioxide (CrO3)
DI Water (H20)
Hydrofluoric Acid (HF)

Ambient A Series
Slope Etch Etch Phosphoric Acid (H3PO4)
Acetic Acid (CH3COOH)
Nitric Acid (HNO3)

55°C QA Series
Standard Resist Strip
(Do not use w/aluminum)
SiO2 Resist Strip Sulfuric Acid (H2SO4)
Hydrogen Peroxide (H2O2)
95-96% 110-140°C QA Series
2:1 Etch Etch DI Water (H2O)
Hydrofluoric Acid (HF)

Ambient A Series
Wafer Rinsing Rinsing DI Water (H2O) 100% Ambient DR-Series
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