Terra Universal - Critical Environment Solutions

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Photoresist Deposition Glove Box

Photoresist Deposition Glove Box

Photoresist Deposition Glove Box

Radius corners
allow easy cleaning
glove box rounded corners
Application Requirements
  • Temperature: 68°F (20°C) constant (requires cooling)
  • Humidity: 5 - 10% RH
  • Process Gas: Various gas mixtures
  • Pressure: 0.1" WG
  • Access: Accordion sleeve gloves; dual-side air locks; Bottom clean-out
  • Particle Control: Class 10 conditions, maintained by laminar flow of HEPA-filtered gas, recirculated via sub-floor & rear plenum chambers
Designed to provide a clean, moisture-free environment for applying photoresist, this glove box is large enough to accommodate wafer spinners used in the deposition process.
 
It incorporates a high-volume process gas mixer that controls percentages of two process gases. A three-sided plenum design recirculates the process gas through dual filter/fan modules for HEPA filtration (99.99% efficient @ 0.3µm particles). Magnehelic® gauges and backpressure alarms ensure filter/fan efficiency. In addition, the bottom plenum includes cooling coils that compensate for heat-generating process equipment to ensure a constant temperature of 68°F (20°C).
 
Dual-side air locks afford easy loading and unloading of wafers. The radius corners of all internal seams allow easy wipe-down and eliminate cracks where particles can collect.
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